• Project
    • OVERVIEW
    • OBJECTIVES
    • CONSORTIUM
  • Use Cases
    • Circular electronic devices
    • Sustainable manufacturing for electronics
    • Environmentally compatible single-use electronics
  • Results
    • Use Cases Results
    • White Paper
    • Public deliverables
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Public deliverables

h PDF
D1.1_Materials Specifications and initial testing plan_v1.0
PDF • 1.13 MB
h PDF
D1.2_Processes Specifications and initial testing plan_v1.0
PDF • 1.12 MB
h PDF
D1.3_Validation and testing plan_v1.0
PDF • 1.71 MB
h PDF
D1.6_Material and process validation and testing results_v1.0
PDF • 5.04 MB
h PDF
D3.4_Final prototypes for Gen 3, including_v1.0
PDF • 12.4 MB
h PDF
D4.2_Analysis of life cycle-based environmental impacts and_v1.0
PDF • 524 KB
h PDF
D4.5_Final description of the e-co2-design framework_v2.0
PDF • 3.79 MB
h PDF
D4.6_Life cycle assessment and handprint study results_v2.0
PDF • 6.16 MB
h PDF
D4.7_Review on the design and implementation_v1.0
PDF • 2.02 MB
h PDF
D5.6_Use case booklet_v1.0
PDF • 23.6 MB

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The project is co-funded by the European Union under grant agreement 101112109. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or Chips Joint Undertaking. Neither the European Union nor the granting authority can be held responsible for them. This project is supported by the Chips Joint Undertaking and its members under grant agreement 101112109 including top up funding by Netherlands, Austria, Germany, Spain, Finland, France, Latvia, Poland and Sweden. This work also received funding from the Swiss State Secretariat for Education, Research and Innovation (SERI).

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